Cutting/Singulation

QFN Package Singulation Process
QFN Package Singulation Process

Most blades used to dice QFN throughout the industry today are based upon a resinoid binder, although both nickel and metal sintered blades may be successfully used in specific cases.

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Dicing Through Hard and Brittle Materials

Dicing Through Hard and Brittle Materials

A high percentage of micro electronics dicing applications require dicing completely through the substrate. While partial dicing is relatively easy, dicing through hard and brittle materials creates both mounting and quality problems. This article discusses various mounting techniques and quality problems related to the dicing process.

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