TPT application: bump bonding
Here we present a special bond application: bump bonding with & without tail.
Bump bonding is used for flip-chip applications. For flip-chip assembly a chip is mounted top-sidedown directly on a substrate/chip. No wires are used. The contact is established by beforehand applied bumps.
TPT application: ribbon bonding
Here we present a special bond application: bonding with ribbon wire.
Advantages of ribbon connections are the low impedance and the considerable heat dissipation. Due to these characteristics ribbons are frequently used, for example in RF technology.