Packaging/Die & Wire Bonding

TPT application: bump bondingTPT application: bump bonding

Here we present a special bond application: bump bonding with & without tail.
Bump bonding is used for flip-chip applications. For flip-chip assembly a chip is mounted top-sidedown directly on a substrate/chip. No wires are used. The contact is established by beforehand applied bumps.

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TPT application: ribbon bondingTPT application: ribbon bonding

Here we present a special bond application: bonding with ribbon wire.
Advantages of ribbon connections are the low impedance and the considerable heat dissipation. Due to these characteristics ribbons are frequently used, for example in RF technology.

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