Reliability Test on Wafer/on Component

Integrated WLR Test System

This integrated WLR test system is capable of testing: copper and aluminum interconnects; electromigration (EM) and stress migration (SM); Intra-level dielectrics (ILDs); bias-temperature stress (BTS); Gate oxides; Time-Dependent Dielectric Breakdown (TDDB) and stress-induced leakage current (SILC); MOS transistors; Hot Carrier Injection (HCI); Vt stability; negative-bias temperature instability (NBTI)