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MiNaPAD Forum 2019 – May 22-23 GRENOBLE FRANCE

Meet Electron Mec’s Staff in Grenoble at MiNaPADForum 2019  the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » which be held in Grenoble, France, on WTC congress center on May 22-23, 2019.

Productronica 2017 November 14-17, Munich Germany

Meet Electron Mec’s Staff at Productronica 2017. The world’s leading trade fair will not just be a gathering for the industry’s decision-makers and innovators, but also for technology enthusiasts—and everyone who wants to be one.

European Microwave Week – Oct. 8th-13th, Nuremberg Germany

Meet Electron Mec’s Staff at European Microwave Week in Nuremberg. The exhibition will feature 300 international exhibitors demonstrating the latest in microwave innovations. It will provide an unrivalled opportunity for visitors to see and ask questions related to the latest products.

From Cascade Microtech GmbH to FormFactor GmbH

We would like to inform you that as of Oct. 1st, 2017 Cascade Microtech GmbH will change its name, and begin operating under the name: FormFactor GmbH.

EMPC 2017 Warsaw University of Tecnology, Sept. 10 to 13

Meet Electron Mec’s Staff at EMPC 2017 in Warsaw, the 21st European Microelectronics and Packaging conference and exhibition.

Semicon Europe 2016 – Grenoble OCT 25-27

Meet Electron Mec’s Staff at Semicon Europe 2016 the largest Microelectronics Event in Europe.

Fotonica 2016 – Roma June 6-8 2016

Visit Electron Mec at FOTONICA 2016 the 18th Italian National Conference on Photonic Technologies


CASCADE MICROTECH has evolved its probe station user environment to an unprecedented level of power and efficiency with the latest release of Velox™

BJ830 Ball-Wedge Bonder

HESSE MECHATRONICS introduces the New BJ830 a Fully Automatic Large Area Ball-Wedge Bonder.