Core competences

  • Packaging design/developing and prototyping (CSP, 3D, SIP, …)
  • Technical support and manual equipment for R&D laboratories
  • Integrated solutions for production lines from wafer to package
  • Wafer probing and packaged testing
  • Environment control (Cleanrooms, wet benches, facilities)

Equipment portfolio

  • wafer photolithography
  • laser marking
  • electrical probing
  • laser repair
  • dicing of wafers
  • die/wire bonding (standard and stack dies)
  • pull/shear test on final assembly
  • Burn-In loaders, handlers
  • Scanning Acustic Microscopy and X-ray
  • cleanrooms
  • gases treatment, waste water and facility services


Related Information

Challenges and Future Directions of Laser Fuse Processing in Memory Repair
This paper reviews the current status of laser fuse processing and discusses the challenges ahead. Various processing parameters are discussed including laser wavelengths, laser pulse duration and shaping, laser beam polarization, laser beam positioning accuracy, and thermal effect, and their impacts on fuse size limitation. We also examine the interrelationships among these parameters
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