Core competences

  • Technical support and manual equipment for R&D laboratories
  • Wide range of automatic equipment for production lines
  • Full packaging solutions including application support
  • TSV (Through Silicon Vias)
  • Environment control solutions (Cleanrooms, Facility services)

Equipment Portfolio

  • wafer photolithography (coating, UV exposure, develop and etching)
  • wafer bonding
  • thermal processing
  • bonded wafers laser marking
  • electrical and mechanical probing on wafers
  • dicing of wafers
  • die bonding
  • wire bonding
  • pull/shear test on final assembly
  • cleanrooms
  • gases treatment, waste water and facility services


Related Information

Latest Metal Technologies for 3D Integration and MEMS Wafer Level Bonding
Microelectrical-mechanical systems (MEMS) devices have experienced impressive and steady growth as they are integrated into people’s everyday lives. Since their conceptualization in the 1970’s, they have progressed from laboratory curiosity to integration in high-end systems, and, more recently, to widespread application in popular consumer devices.
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