Our Partners
- Production dicing saws
- Wafer mounters
- Wafer cleaning stations
- Blades, Flanges and accesories
- Rapid thermal processing
- Programmable process furnaces (single tube)
- Solder reflo ovens (chamber bench top)
- Manual manipolator
- Hot plates
- Plating
- Molding
- Trim & Form
- Singulation
- Laminar air flow benches
- Fan filter unit (HEPA)
- Softwall cleanrooms
- Cleanrooms
- Epoxy and euretic manual die bonders
- Photoresist spinner for laboratory
- Microtensile tester
- Clean solution for waste gas abatement systems
- Production flip-chip placers
- RF-ID production line
- Thermal processing technology:
Photovoltaics
Electronics
Healthcare
Materials
- Epoxy die bonders
- Soft solder die bonders
- Ball bonders
- Flip-chip bonders
- Rework stations
- Manual flip chip bonders
- Wafer mark, wafer trimming and memory repair
- Thin and Thick film trimming
- Embedded passive component trimming
- Laser marking / cutting / micro-machining
- ESD test equipment
- Automatic wedge bonders
- Heavy wire wedge bonders
- Automatic ultrasonic flip chip bonders
- Automatic dispenser systems
- Chrome blanks masks
- Storage dry boxes
- Semiconductor measurements
- Solderability for SMT, components and PCB
- Wetting balance
- Devices and module handlers for memories
- Logic test handlers
- Burn-in loader/sorter
- TDBI (Test during burn in)
- Integrated test interface solutions
- Technical Ceramics
- Parallel seam welding
- Resistance welding
- Glovebox enclosure
- Process vacuum oven
- Chemical Vapor Deposition
PECVD, LS-CVD®, MOCVD - Plasma Etching
RIE, ICP,BOSCH DRIE - Surface Treatments
Plasma Cleaners
UV-Ozone Treatments
- Wedge bonding tools
- Capillaries
- Die bonding tools
- Die Bonding
- Flip Chip Bonding
- Reflow
- Fluxless Eutectic Bonding
- Thermocompression Bonding
- Ultrasonic Bonding
- UV-Curing Bonding
- Adhesive Bonding
- Spinners and Mask aligners
- Probers
- Scribers
- Silicon Anodic wafer bonders
- Qualifying and testing solutions
- Customized silicon wafers