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Advanced Dicing Technologies
- Production dicing saws
- Wafer mounters
- Wafer cleaning stations
- Blades, Flanges and accesories
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Advantest
- IC Characterization and Functional Evaluation Test System
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ATV
- Programmable process furnaces (single tube)
- Solder reflow ovens (chamber bench top)
- Manual manipolator
- Hot plates
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Cammax Precima
- Epoxy manual die bonders
- Eutectic manual die onders
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FormFactor
- Probes
- Probe Stations
- Reliability Testers
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Celadon
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Centrotherm Clean Solutions
- Clean solution for waste gas abatement systems
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Datacon-Besi
- Production flip-chip placers
- RF-ID production line
- Epoxy die bonders
- Soft solder die bonders
- Flip-chip bonders
- Molding
- Trim & Form
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DELO Adhesives
- high-tech adhesives and epoxy resins
- curing and dispensing systems
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DENTON VACUUM
- Thermal evaporation
- E-beam evaporation
- Sputtering
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Despatch Industries
- Thermal processing technology: Photovoltaics, Electronics, Healthcare
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Electron Mec Test Interface Solutions
- Test interfaces
- Docking solutions
- Manipulators
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Finetech
- Rework stations
- Manual flip chip and die bonders
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Heraeus
- Wires and Ribbons for wire bonding applications
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Hesse-Mechatronics
- Automatic wedge bonders
- Automatic ball bonders
- Heavy wire wedge bonders
- Automatic ultrasonic flip chip bonders
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Hoya
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Maury Microwave
- Devices Characterization Solutions
- Precision Calibration &Interconnect Solutions
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Materials Development Corporation
- Semiconductor measurements
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Metronelec
- Solderability for SMT, components and PCB
- Wetting balance
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MUSASHI engineering
- Dispense valves (P/T, Jet, Volumetric)
- Table Top Dispenser
- Fully Automatic Dispenser
- Consumables (Needles, Nozzles and Syringes)
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MVP
- Lead Frame Die, Wire and Epoxy AOI
- Die and Wire Bond AOI
- BGA Inspection AOI
- Dice Wafer AOI
- Metrology AOI
- 3D Solder Paste
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NTK
- Technical Ceramic packages for semiconductor and opto-electronic industries
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PVA-Tepla
- Plasma based equipments for life sciences
- Plasma cleaners for back end applications
- Plasma treatment for front end applications
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Pyramid Engineering Services
- Parallel seam welding
- Resistance welding
- Glovebox enclosure
- Process vacuum oven
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SAMCO
- Chemical Vapor Deposition PECVD, LS-CVD®, MOCVD
- Plasma Etching RIE, ICP,BOSCH DRIE
- Surface Treatments Plasma Cleaners UV-Ozone Treatments
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SIL’TRONIX
- CZ and FZ type Silicon Wafer and Crystal. Production of small and medium volumes
- Customer Specification
- Machining-Slicing-Grinding
- Downsizing-Edge grinding
- Surface preparation
- Deposition and Metalization
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Small Precision Tools
- Capillaries and Wedge Bonding Tools
- Pick and Place Tools
- Fluid Dispensing Tools
- Fine Ceramic & Machining Parts
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SUSS MicroTec
- Spin Coater, Spray Coater, Developer
- Mask Aligner
- Laser Processing Systems
- Wafer Bonder
- Photomask Equipment
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TPT
- Manual fine wire bonders
- Manual heavy wire bonders
- Die bonders
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VDI
- Vector Network Analyzer Extender
- Spectrum Analyzer Extension Modules
- Signal Generator Extension Modules
- Transmitter Components and Modules
- Receiver Components and Modules
- Passive Components
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Virginia Semiconductors
- Customized silicon wafers
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Visiorobotics
- Visual Inspection System
- Robotics
- 3D Imaging Applications
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