Partners

Advanced Dicing Technologies

  • Production dicing saws
  • Wafer mounters
  • Wafer cleaning stations
  • Blades, Flanges and accesories

Advantest

  • IC Characterization and Functional Evaluation Test System

ATV

ATV

  • Programmable process furnaces (single tube)
  • Solder reflow ovens (chamber bench top)
  • Manual manipolator
  • Hot plates

Cammax Precima

Cammax Precima

  • Epoxy manual die bonders
  • Eutectic manual die onders

FormFactor

  • Probes
  • Probe Stations
  • Reliability Testers

Celadon Systems

Celadon

  • Probe Cards

Centrotherm Clean Solutions

  • Clean solution for waste gas abatement systems

Datacon/Besi

  • Production flip-chip placers
  • RF-ID production line
  • Epoxy die bonders
  • Soft solder die bonders
  • Flip-chip bonders
  • Molding
  • Trim & Form

Go to: DELO site

DELO Adhesives

  • high-tech adhesives and epoxy resins
  • curing and dispensing systems

DENTON VACUUM

  • Thermal evaporation
  • E-beam evaporation
  • Sputtering

Despatch Industries

  • Thermal processing technology: Photovoltaics, Electronics, Healthcare

 Electron Mec Test Interface Solutions

  • Test interfaces
  • Docking solutions
  • Manipulators

Finetech

  • Rework stations
  • Manual flip chip and die bonders

heraeus

Heraeus

  • Wires and Ribbons for wire bonding applications

Hesse-Knipps

Hesse-Mechatronics

  • Automatic wedge bonders
  • Heavy wire wedge bonders
  • Automatic ultrasonic flip chip bonders

Hoya

Hoya

  • Chrome blanks masks

Maury Microwave

  • Devices Characterization Solutions
  • Precision Calibration &Interconnect Solutions

Materials Development Corporation

Materials Development Corporation

  • Semiconductor measurements

Metronelec

  • Solderability for SMT, components and PCB
  • Wetting balance

Mirae

  • Devices and module handlers for memories
  • Logic test handlers
  • Burn-in loader/sorter
  • TDBI (Test during burn in)
  • Integrated test interface solutions

MUSASHI engineering

  • Dispense valves (P/T, Jet, Volumetric)
  • Table Top Dispenser
  • Fully Automatic Dispenser
  • Consumables (Needles, Nozzles and Syringes)

NTK

  • Technical Ceramic packages for semiconductor and opto-electronic industries

PVA-Tepla

PVA-Tepla

  • Plasma based equipments for life sciences
  • Plasma cleaners for back end applications
  • Plasma treatment for front end applications

PES

Pyramid Engineering Services

  • Parallel seam welding
  • Resistance welding
  • Glovebox enclosure
  • Process vacuum oven

SAMCO

  • Chemical Vapor Deposition PECVD, LS-CVD®, MOCVD
  • Plasma Etching RIE, ICP,BOSCH DRIE
  • Surface Treatments Plasma Cleaners UV-Ozone Treatments

 

SIL’TRONIX

  • CZ and FZ type Silicon Wafer and Crystal. Production of small and medium volumes
  • Customer Specification
  • Machining-Slicing-Grinding
  • Downsizing-Edge grinding
  • Surface preparation
  • Deposition and Metalization

smallprecisiontools

Small Precision Tools

  • Capillaries and Wedge Bonding Tools
  • Pick and Place Tools
  • Fluid Dispensing Tools
  • Fine Ceramic & Machining Parts

Suss

SUSS MicroTec

  • Spin Coater, Spray Coater, Developer
  • Mask Aligner
  • Laser Processing Systems
  • Wafer Bonder
  • Photomask Equipment

TPT

  • Manual fine wire bonders
  • Manual heavy wire bonders

Virginia Semiconductors

Virginia Semiconductors

  • Customized silicon wafers

 

Visiorobotics

  • Visual Inspection System
  • Robotics
  • 3D Imaging Applications