|Customized high-tech adhesives for our customers in all areas of business, from microelectronics to display technology to the smart card industry to photovoltaics.
DELO-CA cyanoacrylates allow fast curing within seconds, especially of small bonding areas.
DELO-DUALBOND adhesive. These radiation-curing adhesives offer the possibility to combine light curing with heat curing or humidity curing.
DELO-DUOPOX, two-component epoxy resins. They cure at room temperature after mixing. Good adhesion, high resistance to chemicals, and excellent mechanical properties.
DELO-GUM are suitable for permanently elastic and highly flexible joins.
DELO-KATIOBOND photoinitiated-curing epoxy resins, as chip encapsulants for fast in-line processes, or as sealants with a high water barrier effect for applications in organic electronics.
DELO-ML methacrylates cure under exclusion of air and the catalytic influence of metal ions.
DELOMONOPOX one-component epoxy resins, to heat-curing cationic products and heat-curing acrylates.
DELO-PHOTOBOND Photoinitiated-curing acrylates.
DELO-PUR polyurethanes give good tough-elastic properties and excellent strength.
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Innovative system technology around adhesive curing and dispensing