Automatic Wedge and Ball Bonders

AUTOMATIC WEDGE AND BALL BONDERS

Hesse GmbH develops and manufactures ultrasonic wire bonders for all wire dimensions as well as ultrasonic flipchip bonders in combination with standardized or customized automation solutions.

Bondjet B820 – High Speed Fully Automatic Fine Wire Wedge Bonder

The Bondjet BJ820 is the latest development of Hesse’s wedge bonding innovation, responding to all wire bonding challenges on a single platform for a variety of applications such as RF and microwave devices, COB, MCM and hybrids, fibre-optics and automotive using aluminium wire, gold wire or ribbon. The BJ820 defines the benchmark in the industry for example by offering:

  • Largest work area 305 mm x 410 mm
  • High speed: up to 6 wires per second
  • Great axis accuracy: 1 μm bei 3 σ
  • Wire size: Al, AU down to 12.5µm, ribbon up to 25µm x 250µm
  • Fine pitch < 40 µm
  • Piezo-technology bondheads
  • Vibration control
  • Backup and traceability system PBS200
  • Quality control by deformation, US-current or PiQC
  • E-Box: patented solution for optimized tool change and optical adjustment


BONDJET BJ830 – FULLY AUTOMATIC LARGE AREA BALL-WEDGE BONDER

The Bondjet BJ830 is a fully automated, thermosonic fine wire ball-wedge bonder with a large working area. The BJ830 is designed for  wire bonding challenges on a single platform. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics.

  • The largest working area of ball-wedge bonders : X: 305 mm (12″); Y: 410 mm (16″); Z: 31 mm (1.22″)
  • Wire sizes: 17.5 µm – 50 µm (0.7 mil – 2.0 mil)
  • E-Box: graphical ball inspection.
  • Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits.
  • SECS/GEM – integrated standardized server connection for automation and communication

          

Bondjet BJ955/BJ959 – Fully Automatic Heavy Wire Bonder

Bondjets BJ955 and BJ959 are ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually. Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm with only one bondhead.

  • Largest work area
    BJ955: 305 mm x 410 mm Z: 42 mm
    BJ959: 370 mm x 560 mm Z: 42 mm
  • Great axis accuracy
  • Wire size: 125µm up to 600µm (5mil – 24mil) for Al, Cu, AlCu (aluminium, copper, Al/Cu Hybrid),
  • Ribbon: 250um x 25um up to 2000um x 400um for Al, Cu, AlCu (Cu: 200um)
  • E-Box: patented solution for optimized tool change and optical adjustment
  • Active cutting system for highest cutting accuracy
  • Unique bondheads with integrated pull test
  • Process integrated Quality Control (PiQC) for advanced quality monitoring

BONDJET BJ931 – DUAL HEAD HEAVY WIRE BONDER

The High Speed Fully Automatic Dual-Head Wedge Bonder Bondjet BJ931 meets the latest technology and flexibility demands for automotive and power electronics applications, handling heavy aluminum, copper and gold wire and ribbon on two specialized bondheads that can be changed out in minutes.

  • Largest working area in the industry: 100 x 90 mm
  • Wire sizes: Al, AU: 75 µm up to 500 µm, Cu: 125 – 500 µm, ribbon: 750 x 100 µm up to 2000 x 300 µm
  • Highest UPH due to linear motors for all axes!
  • E-Box: patented solution for optimized tool change and optical adjustment
  • Active cutting system for highest cutting accuracy
  • Unique bondhead’s with integrated pull test
  • Process integrated Quality Control (PiQC) for advanced quality monitoring

Gallery