|Common via formation and circuit pattern structuring required in advanced packaging and advanced substrates, has relied on traditional photolithography processing techniques (e.g. steppers and mask aligners). However, with recent advancements in laser ablation and complementary technologies, laser ablation promises further reductions in manufacturing costs as well as enhancements in chip performance.
SUSS MicroTec offers two very different types of laser ablation technologies: Excimer and Solid State. Each of these types of laser systems have their own unique applications and capabilities.
SUSS MicroTec Laser Processing Systems
SUSS MicroTec uses various modern laser technologies. Laser processing systems are based on excimer laser or solid-state laser and provide excellent precision for microstructuring applications.
SUSS MicroTec‘s laser processing platform ELP300 is based on novel excimer laser stepper technology. With its laser ablation functionality the system enables direct patterning of photo as well as non-photo polymers, dielectrics and thin metal layers. Download brochure.
SUSS MicroTec’s SLP300 laser processing system is based on the most recent advances in solid-state laser technology, including beam shaping and control. Without the need for masks, the systems operate in a direct ablation mode. Examples of applications include microstructuring of vias, drilling and dicing.