Lithography Inspection

Front to Back Alignment Verification

Double side alignment and exposure is frequently used in the manufacture of MEMS, power devices, integrated optics and PCBs. Top-to-bottom side Measurement Systems from SUSS MicroTec are the ideal tool to verify the alignment of your double side alignment and exposure processes.

DSM 200 Gen 2 – Automated System

Fully automatic cassette to cassette front-to-back alignment verification offering excellent measurement accuracy and repeatability.
(model type: DSM200 Gen2)

DSM8 Gen 2 – Manual System

Reliabilty, precision and speed make the SUSS MicroTec DSM8 the tool of choice for both the R&D and production environment.
(model type: DSM8 Gen2)


more info onVideos : Video 1