Manual die Bonders


FINEPLACER® matrix ma

Semi-automatic Die Bonder

The FINEPLACER® matrix ma is a semi-automatic bonder representing the latest development from Finetech. Encompassing the “Built to be Best” philosophy, this system points the way forward for the Finetech product family.

Incorporating a new ergonomic approach to bonder design, this state-of-the-art platform, with large working area and high placement accuracy, combines application modularity within an open hardware and software environment.

Supporting a virtually unlimited field of applications and numerous bonding technologies, the system ensures compatibility with future technologies as users transition from R&D into production.

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Multi-purpose Die Bonder

The FINEPLACER® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.

This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding.

Designed for prototyping or low-volume production, R&D and universities

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Manual adhesive and eutectic die bonders

Cammax Precima specialises in the design and manufacture of assembly equipment for adhesive and eutectic processes, in the production of integrated circuits, multi chip modules, microstructures, optoelectronic devices and sensors.

In recent years, Cammax maintained a significant profile within the telecommunications industry, offering a range of manual and semi-automatic die attach equipment, capable of bonding delicate devices (GaAs) to a placement accuracy of 5 microns.

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