Manual die Bonders

 

FINEPLACER® lambda 2

Sub-Micron Bonder

The all-new FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more.

The completely revised bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility to protect your investment in the face of ever-changing challenges.

Due to an ergonomic machine design and software-supported user guidance, the user remains at the center of action. Powerful optical systems allow the user to keep an overview at all times, even when working in the sub-micron range.

The FINEPLACER® lambda 2 shares a common module range and innovative operating software with Finetech’s automatic bonding systems to ensure a seamless process migration to series production. Ask us about our scalable solutions.

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FINEPLACER® sigma

Advanced Sub-Micron Bonder

The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N.

The system is ideal for all types of precision die bonding and flip chip applications at chip and wafer level. This includes complex 2.5D and 3D IC packages, Focal Plane Arrays (i.e. image sensors), MEMS/MOEMS, and more.

Placing small devices on large substrates is made possible by the FPXvisionTM optical system design. With this alignment system, the smallest structures at the highest magnification can be viewed across the entire field of view. Moreover, FPXvisionTM introduces pattern recognition to a die bonder with manual alignment.

The FINEPLACER® sigma embraces all features of an assembly and development platform capable of handling an unlimited spectrum of applications and prepared for future technologies.

 

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FINEPLACER® pico ma

Multi-purpose Die Bonder

The FINEPLACER® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.

This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding.

Designed for prototyping or low-volume production, R&D and universities

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TPT HB75 Semiautomatic Die Bonder

  • Pick & Place Microchip from Die-Carrier and place it to your surface
  • Epoxy Dispensing. Simple and exact handling.
  • Epoxy Stamping. Fast and precise stamping process.
  • Rotation Bondhead for Quick Change between tools.
  • True vertical Z movement. Motorized Z-axis with 90° linear movement.
  • Angle alignment. Microchip alignment thru the rotable work plate.
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