Manual Wire Bonders

TPT MANUAL WIRE BONDER

Relying on over 25 years wire bonding knowhow,TPT designs and manufactures a complete range of manual and semi automatic wire bonder machines.

TPT is a privately owned company, with the goal to provide the highest quality wire bonding equipment.

Based in Munich, TPT draws strenght from Germany’s high technology region.

TPT bonders are used in many leading Univerities, Institutes and Semiconductor Aerospace & Medical device companies throughout the world.

 

 

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HB05 Manual Bonder

Wire sizes from 17µm to 75µm - Ribbon sizes up to 25×250µm

  • Gold, aluminum, silver & copper wire
  • 4″ TFT display & push dial
  • Motorised Wire Clamp
  • Wedge, ball & ribbon bonding
  • Storage of 20 parameters
  • Deep & wide access

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HB10 Automatic Z axis

Wire sizes from 17µm to 75µm – Ribbon sizes up to 25×250µm

  • Gold, aluminum, silver & copper wire
  • Automatic bond height adjustment
  • Motorised Wire Clamp
  • Wedge, ball & ribbon bonding
  • Storage of 100 parameters
  • Motorised Wire Spool
  • 6.5″ Touch Panel
  • Deep & wide bond access

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HB16 Automatic Z & Y axis

Wire sizes from 17µm to 75µm – Ribbon sizes up to 25×250µm

  • Gold, aluminium, silver & copper wire
  • 6.5″ Touch Panel
  • Storage of 100 parameters
  • Motorised Wire Spool
  • Wedge, ball & ribbon bonding
  • Automatic bond height adjustment
  • Deep & wide access
  • Repeatable Loop Profiles
  • Simple Loop Programming
  • Motorised Wire Clamp

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HB30 Heavy Wire Bonder

Wire sizes from 100µm to 500µm – Ribbon sizes up to 300×2000µm

  • Aluminium & copper wedge bonding
  • Automatic bond height adjustment
  • Deep & Wide Bond Access
  • Repeatable Loop Profiles
  • Simple Loop Programming
  • High precision cutting sequence
  • 6.5″ Touch Panel
  • Storage of 100 parameters
  • Vacuum Stage Fixation

Brochure Download