Wafer Bonders for Temporary Bonding
SUSS MicroTec’s highly sophisticated wafer bond system is designed for the special process requirements of temporary bonding and supports a wide array of adhesive systems.
Debonders complement SUSS MicroTec’s portfolio for temporary wafer bonding. The systems offer various technologies for separating the wafer from the carrier and subsequent cleaning of the components.
Manual Wafer Bonders
Wafer Bonder for Temporary Bonding
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