Vacuum Ovens

 ATV

ATV Technologie GmbH

offers long-standing experience in designing and manufacturing high-end process stoves featuring precise temperature control and excellent homogeneity for semiconductor technology and micro electronics as well as a worldwide network of special representatives who will take care of on-site sales and service.

 SRO i-Line

SRO i-Line High Volume Production

SRO i-Line is a high volume production tool used for vacuum reflow soldering. The SRO i-Line comes standard with formic acid bubblers and auto refill assembly. This in combination with the standard equipped vacuum pump guarantees the best reflow soldering results compared to any other standard equipment in the market. Formic acid together with vacuum results in significant void reduction over the full reflow soldering area as well as the entire product load.

Features:

  • High Throughput
  • Short cycle times
  • Vacuum level 10¯² mbar
  • Formic Acid
  • Process temperature up to 450°C
  • Temperature ramp-up rate 3K/sec.
  • Temperature cool-down rate 2K/sec.
  • Excellent temperature uniformity
  • IR Heating
  • Small footprint (No footprint change up to 3 Process Chambers)

More info.

 SRO 700

IR Vacuum Reflow System – Table Top

SRO 700

Features:

  • Temperature: 450°C, up to 750°C
  • Heated area: 230 x 217 mm
  • Fast heated plate ramping:
    - Ramping up > 3.5°C/second
    - Ramping down > 2°C/second
  • Rapid single wafer processing > 20°C/second
  • 100 steps per program
  • Oxygen < 1,0 ppm
  • Formic acid activated nitrogen
  • Ultimate Vacuum: ~ 5 x 10-5 mbar
  • Flux less, with flux and solder paste

 

General:

The perfect soldering systems, solder reflow ovens (SRO) with rapid thermal annealing and brazing capability are IR lamp heated multi-purpose “cold wall” process ovens. The SRO is ideal for R&D and process development.

 

Applications:

Die attachment, IGBT/DBC, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo compression bonding, pin fins, Hybrid assembly, MMIC die attachment, power modules, electric vehicle controls, power solar cells.

More info.

 SRO 714/716

 IR Vacuum Reflow/Brazing/RTA

 SRO 714/716

Features

  • Temperature: up to 1100°C
  • Heated plates, up to 450 x 450 mm
  • Fast heated plate ramping• Ramping up > 3.5°C/second• Ramping down > 2°C/second
  • Rapid single wafer processing > 50°C/second
  • 100 steps per program
  • Oxygen < 0,1 ppm
  • Hydrogen up to 100%
  • 40 kHz/2,45 GHz plasma
  • Formic acid activated nitrogen
  • Ultimate Vacuum: ~ 7 x 10-7mbar
  • High pressure atmosphere: up to 3 bar (abs)
  • Flux less, with flux and solder paste
  • Automation: cassette to cassette or in-line

General

The perfect soldering systems, solder reflow ovens (SRO) with rapid thermal annealing and brazing capability are IR lamp heated multi-purpose “cold wall” process ovens. The SRO is ideal for R&D, process development as well for low to high volume production.

Applications

Die attachment, IGBT/DBC, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo compression bonding, pin fins, Hybrid assembly, MMIC die attachment, power modules, electric vehicle controls, power solar cells

More info.


 PEO

Multipurpose Fast Ramping Process Furnace

PEO 601 – 603 – 604 – 612

 Features

  • Green energy no energy/gas consumption during stand by process mode: loading at room temperature – ramp up/ multiple ramps- processing with multiple soak steps – controlled active cool down
  • max. 1100°C continuous wafer/substrate temperature
  • Excellent low temperature capability: 150°C – 1 100°C with < +/- 1,5 K over all uniformity by gas preheating • 100 steps per program
  • Ultimate vacuum ~ 7 x 10-7 mbar
  • Up to 100 process wafers with < +/- 1,5 K over all uniformity
  • Fastest ramping: within 15 minutes up to 1 000°C – less 60 minutes to < 100 °C
  • Slowest ramping: 1 K per 100 minutes
  • Semiconductor grade quartz glass process chamber
  • Multipurpose: with easy swap quartz glass In Liners/elephants
  • Floor space saving: short process tube with all side heaters
  • True atmospheric pressure H2/CO/CH4/C2H2 processing safety: quartz glass process chamber inside N2 purged metal box
  • Up to 300 mm Ø or 12″ x 12″
  • Semi S II safety standards for PH3/B2H6/GeH4/SeH2
  • IR lamp heated on request
  • O2 < 0,1 ppm

General

The multipurpose fast ramping process furnaces PEO with energy and floor space saving capability are Kanthal ® wire heated “hot wall” process ovens. The PEOs are ideal for R&D, process development of unique and sophisticated new processes as well for low to medium volume production.

Applications

LPCVD, CVD, Epitaxy, Polysilicon, Silicon Nitride, LTO, TEOS, solid/liquid/gas precursor diffusion, low k, HSQ, HMDS, wet/dry thermal oxide, Pyrogenic oxidation, VECSEL, MOCVD, Trans LC, Si nano wires, post implanting annealing, carbon nano tubes, Graphene, solar cell, batch ALD, Polyimide/BCB curing, wafer bump reflow, alloying, thick film paste firing, LTCC sintering, annealing under inert atmosphere/Hydrogen/high vacuum, Tellurium/Se/Hg PVD

More info.