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Application & Turn Key consulting
Equipment Service
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New Packaging Developments and Production
iX-factory
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Applications
Probing & Testing (cryo, vacuum, pressure)
Reliability Test on Wafer/on Component
Cutting/Singulation
Packaging/Die & Wire Bonding
Pull/Shear Testing
3D-Through Silicon Vias
Nanoimprinting
Wafer Bonding
Scanning acoustic Microscopy
Plasma Etching
Products
Lithography
Mask Aligners
Nano imprinting
Spin & Spray Coating, Development
Lithography Inspection
Silicon Wafers and Crystals
Substrate Bonders
Mask Blanks
Mask and wafer cleaners
Test & Measurements
Probe Stations
DC, RF, Resistivity probes and probe cards
IC Characterization and Functional Evaluation Test System
Tuners
Reliability Testers
Dicing Saws & Blades
Wire Bonders and Wires
Manual Wire Bonders
Automatic Wedge and Ball Bonders
Tools (Wedge, Caps and Pick Up)
Wire & Ribbon
DIE Bonders
Manual die Bonders
Automatic Die Bonders
Flip-Chip Bonders
Die Sorters
Pick and place , Dispensing tools
AOI
Dispenser
Rework
Adhesives
Thermal processing
Hot Plates
Industrial Ovens
RTP/RTA Ovens
Vacuum Ovens
Abatement and environmental solutions
UV – Ozone Cleaners
Plasma technologies
CVD Systems
PECVD
LS-CVD
Cleaning Systems
Ashing Systems
Etching Systems
industrial surface treatment
Sputtering and Evaporation
Wet Benches
Test Handlers, Test interfaces , Manipulators
Test HS/SW solution
PCB Manufacturing
Test Sockets and Pogo Pins
Liquid Cooled Thermal System
HALT/HASS Systems
Laser Systems
Clean Rooms
Wetting Balance
Devices
Photovoltaic
LED
Power Devices
MEMS
Memories
Markets
Automotive
Communications
Consumer Electronics
Defence, Aerospace
Fossil & Renewable Energies
Industrial
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Wire Bonders and Wires
Wire Bonders and Wires
MANUAL WIRE BONDERS
AUTOMATIC WIRE BONDERS
TOOLS (WEDGES,CAPS,PICK UP)
WIRE AND RIBBON