Electron Mec

Private Area

Home
About Us
Reach Us
Contact Us
Partners
Services
Staff

Applications

Probing & Testing (cryo, vacuum, pressure)
Reliability Test on Wafer/on Component
Cutting/Singulation
Packaging/Die & Wire Bonding
Pull/Shear Testing
3D-Through Silicon Vias
Nanoimprinting
Wafer Bonding
Scanning acoustic Microscopy
Plasma Etching

Products

Lithography
- Mask Aligners
- Nano imprinting
- Spin & Spray Coating, Development
- Lithography Inspection
Silicon Wafers and Crystals
Substrate Bonders
Mask Blanks
Mask and wafer cleaners
Test & Measurements
- Probe Stations
- DC, RF, Resistivity probes and probe cards
- IC Characterization and Functional Evaluation Test System
- Tuners
- Reliability Testers
Dicing Saws & Blades
Wire Bonders and Wires
- Manual Wire Bonders
- Automatic Wedge and Ball Bonders
- Tools (Wedge, Caps and Pick Up)
- Wire & Ribbon
DIE Bonders
- Manual die Bonders
- Automatic Die Bonders
- Flip-Chip Bonders
- Die Sorters
- Pick and place , Dispensing tools
Dispenser
Rework
Adhesives
Thermal processing
- Hot Plates
- Industrial Ovens
- RTP/RTA Ovens
- Vacuum Ovens
Abatement and environmental solutions
UV – Ozone Cleaners
Plasma technologies
- CVD Systems
  - PECVD
  - LS-CVD
- Cleaning Systems
- Ashing Systems
- Etching Systems
- industrial surface treatment
Sputtering and Evaporation
Wet Benches
CDS
Test Handlers, Test interfaces , Manipulators
Test HS/SW solution
- PCB Manufacturing
- Test Sockets and Pogo Pins
- Liquid Cooled Thermal System
HALT/HASS Systems
Laser Systems
Clean Rooms

Devices

Photovoltaic
LED
Power Devices
MEMS
Memories

Markets

Automotive
Communications
Consumer Electronics
Defence, Aerospace
Fossil & Renewable Energies
Industrial
Life Science

Home ›› Wire Bonders and Wires

Wire Bonders and Wires

MANUAL WIRE BONDERS

AUTOMATIC WIRE BONDERS

TOOLS (WEDGES,CAPS,PICK UP)

WIRE AND RIBBON

HOME | CONTACT US

LEGAL DISCLAIMER | CREDITS

Copyright © 2009 Electron-Mec s.r.l. All Rights Reserved. P.IVA: 01773040157