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Application & Turn Key consulting
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Applications
Probing & Testing (cryo, vacuum, pressure)
Reliability Test on Wafer/on Component
Cutting/Singulation
Packaging/Die & Wire Bonding
Pull/Shear Testing
3D-Through Silicon Vias
Nanoimprinting
Wafer Bonding
Scanning acoustic Microscopy
Plasma Etching
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Lithography
Mask Aligners
Nano imprinting
Spin & Spray Coating, Development
Lithography Inspection
Silicon Wafers
Substrate Bonders
Mask Blanks
Mask and wafer cleaners
Test & Measurements
Probe Stations
DC, RF, Resistivity probes and probe cards
Tuners
Reliability Testers
Dicing Saws & Blades
Wire Bonders and Wires
Manual Wire Bonders
Automatic Wedge and Ball Bonders
Tools (Wedge, Caps and Pick Up)
Wire & Ribbon
DIE Bonders
Manual die Bonders
Automatic Die Bonders
Flip-Chip Bonders
Die Sorters
Pick and place , Dispensing tools
Dispenser
Rework
Adhesives
Thermal processing
Hot Plates
Industrial Ovens
RTP/RTA Ovens
Vacuum Ovens
Abatement and environmental solutions
UV – Ozone Cleaners
Plasma technologies
CVD Systems
PECVD
LS-CVD
Cleaning Systems
Ashing Systems
Etching Systems
industrial surface treatment
Sputtering and Evaporation
Wet Benches
CDS
Test Handlers, Test interfaces , Manipulators
Test HS/SW solution
PCB Manufacturing
Test Sockets and Pogo Pins
Liquid Cooled Thermal System
HALT/HASS Systems
Laser Systems
Clean Rooms
Devices
Photovoltaic
LED
Power Devices
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Wire Bonders and Wires
Wire Bonders and Wires
MANUAL WIRE BONDERS
AUTOMATIC WIRE BONDERS
TOOLS (WEDGES,CAPS,PICK UP)
WIRE AND RIBBON
MANUAL WIRE BONDERS
AUTOMATIC WIRE BONDERS
TOOLS (WEDGES,CAPS,PICK UP)
WIRE AND RIBBON