Calligarich: “Over one hundred attendees and a top‑tier lineup for a rapidly growing event”

As the rise of advanced packaging technologies reshapes Europe’s semiconductor landscape, Milan is preparing to host the next IMAPS Italy event—an important forum for ideas, exchange, and innovation that places Italy at the center of the discussion. On May 5, the Consiglio Hall at the Bovisa campus of Politecnico di Milano will host a full day of technical presentations featuring leading researchers and industry experts.

The International Microelectronics Assembly and Packaging Society (IMAPS) is the world’s leading organization dedicated to packaging, interconnection, and microelectronics assembly. Through its activities, it promotes dialogue among industry, academia, and institutions on key topics such as chiplets, heterogeneous integration, and 2.5D/3D technologies. Luigi Calligarich, President of IMAPS Italy, outlines the scope and expectations of what is set to be a record‑breaking edition.

The workshop program has expanded significantly, and registrations are already very high. How did you put together such a strong lineup?

“Over the years, our workshops have become increasingly anticipated and well attended. For this edition, we quickly expanded the programme to fifteen presentations, featuring a lineup of international market leaders as well as collaborative sessions with Politecnico di Milano and Politecnico di Torino. The overall caliber of the speakers is exceptionally high.

So registrations confirm the strength of the event?

“We have already surpassed one hundred registered attendees, and the venue is expected to be fully booked. The response was outstanding right from the start: the event continues to grow from one edition to the next, clearly demonstrating that Italy can play a leading role in the international discussion on technology implementation.”

With the technology landscape undergoing major change, what will be the workshop’s core themes?

“We are living through a historic moment—a profound paradigm shift in semiconductor assembly technologies. New solutions are emerging that are no longer wafer‑based but panel‑based. This edition is therefore strongly focused on advanced packaging and upcoming developments—strategic technologies that are attracting enormous interest.”

Which presentations will be the highlights of the day?

“The workshop will open with presentations by Fraunhofer IZM and STMicroelectronics on chiplets and panel‑level packaging. These will be followed by contributions from international corporations addressing hybrid bonding for AI and HPC applications, innovative materials, and advanced testing and inspection methodologies. Future trends in semiconductor packaging will also be discussed.”

Silicon Box’s participation is among the most anticipated. Why is it so significant?

“Silicon Box is a new player from Singapore, currently investing in Italy and building a facility fully dedicated to advanced packaging . The company will be represented by Michael Han, a senior executive who—much to our satisfaction—has chosen Italy as the venue for the company’s European debut. It is further confirmation that Italy is attracting high‑tech investments, even against broader global trends.”

What is your overall assessment just a few days before the event?

“As President of IMAPS Italy, I am extremely satisfied with the work carried out by the team and with the partnerships we have established. The presence of leading companies and industry figures, the success of past editions, the relevance of the technological themes, and the arrival of new players with significant investments have all contributed to raising IMAPS’s visibility. We will take stock on May 6, but the strong and enthusiastic participation already clearly marks this edition as a success.”