Calligarich: “A must-attend event for advanced packaging”
From June 3 to 4, 2026, Grenoble will host the new edition of MiNaPAD (Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum), one of the most prestigious European events dedicated to advanced packaging and cutting-edge microelectronics. Organized by IMAPS France, the forum will take place at Maison MINATEC, a scientific center of excellence located in the heart of the city. Two intense days of parallel technical sessions, a high-level exhibition area, and an international lineup of speakers will come together to outline the state of the art in the field, with in-depth discussions on heterogeneous integration, sintering materials, 3D packaging, and environmental sustainability in manufacturing processes. Electron Mec is also among the gold sponsors of this edition, having been an IMAPS member for years and a long-standing presence at the forum.
How would you describe the value of MiNaPAD in the European advanced packaging landscape?
“We are looking at one of the most important events for the French market and the electronic packaging sector. Year after year, MiNaPAD brings together several hundred engineers and specialists from across Europe and beyond, becoming a privileged observatory of the most advanced technological trends. For us, it has always been a key event: we follow it very closely and, in recent years, we have also supported it as a gold sponsor, confirming the strategic value we attribute to it. We will be present with our stand in the exhibition area. It is an outstanding opportunity to meet colleagues, clients, and partners, engage with the main industry players, and gather the insights needed to navigate a market that is constantly and rapidly evolving.”
The 2026 program appears particularly rich. Which speakers and topics do you consider most significant?
“The scientific and industrial level of the speakers is, as always, extremely high. Among the keynotes, particularly noteworthy are STMicroelectronics, with a reflection on end-to-end co-optimization between front-end and back-end in the production of robust and cost-effective microelectronics, and Steffen Kröhnert of ESPAT-Consulting, who analyzes the state of electronic packaging in Europe three years after the EU Chips Act. Also significant is the presence of institutes and companies such as CEA Leti, Fraunhofer IZM, Resonac Corporation, BESI, and UTAC Group—an ensemble that highlights the forum’s strong international vocation.”
What does this participation represent for Electron Mec’s position in Europe?
“MiNaPAD is one of those events where authority and reputation are built, and where the relationships that truly matter are strengthened. Being a gold sponsor is not just about visibility: it is a way to reaffirm our commitment to the European technical and scientific community and to confirm that Electron Mec is a key reference partner in advanced packaging. The attention we receive at each edition encourages us to move forward with even greater determination.”